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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. 1/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 datashee t max 112 segments (seg28com4) multifunction lcd segment driver bu97931fv-lb this is the product guarantees long time support in industrial market. features ? long time support product for industrial equipment ? integrated ram for display data (ddram): 28 x 4 bit (max 112 segment) ? lcd drive output: 4 common output, max 28 segment output ? integrated 1ch led driver circuit ? segment/gpo (max 5port) output mode selectable ? support pwm generation from ext. or internal clock (resolution: 8bit) ? support standby mode ? integrated power-on-reset circuit (por) ? integrated oscillator circuit ? no external component ? low power consumption design ? independent power supply for lcd driving ? support blink function (blink frequency 1.6, 2.0, 2.6, 4.0hz selectable) applications ? industrial equipment ? telephone ? fax ? portable equipment (pos, ecr, pda etc.) ? dsc ? dvc ? car audio ? home electrical appliance ? meter equipment etc. key specifications supply voltage range: +1.8v to +3.6v lcd drive power supply range: +2.7v to +5.5v operating temperature range: -40c to +85c max segments: 112 segments display duty: static, 1/3, 1/4 selectable bias: static, 1/3 interface: 3wire serial interface package w (typ) x d (typ) x h (max) typical application circuit led/gpo using case figure 1. typical application circuit ssop-b40 13.60mm x 7.80mm x 2.00mm .0 v 3. 3v vlcd vdd clkin csb sd scl vss bu97931 fv-lb lcd com0 to com3 seg0 to seg22 led input signal from controlle r clkin external clk input terminal in case being unused , connect to vss or be opened . vled =5. 0v regarding resistor value please detect the value according to input current value ( current max = 20ma ) othe r device seg27 ( gpo 0) to seg23( gpo4)
datasheet datasheet 2/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) block diagram / pin configuration / pin description figure 2. block diagram figure 3. pin configuration (top view) table 1 pin description terminal terminal number i/o unused case function csb 26 i - chip se lect: "l" active scl 27 i - serial data transfer clock sd 28 i - input serial data vdd 29 - - power supply for logic clkin 30 i open / vss external clock input terminal (for display/pwm using selectable); support hi-z input mode at internal clock mode vss 25 - - gnd vlcd 31 - - power supply for lcd com0 to 3 32 to 35 o open common output for lcd seg0 to 22 36 to 40 1 to 18 o open segment output for lcd seg23 to 27 19 to 23 o open segment output for lcd/gpo led 24 o open led driver output blink timing generato r common counte r clkin pwm generato r oscillator lcd bias selector common driver power on reset sd scl vss vss seg0?22 if filter serial interface ddram gpo data latch lcd voltage generato r command resiste r data decode r vlcd csb vdd segment drive r led driver gpo controller segment driver/gpo led com0??com3 seg23...27 seg19 seg18 seg14 seg17 seg13 seg20 seg16 seg7 seg5 seg6 seg8 seg9 seg10 seg11 seg12 seg15 seg23 seg22 seg21 seg24 com1 com2 seg2 com3 seg3 com0 seg0 seg27 seg25 seg26 led csb scl seg4 seg1 vdd clkin vlcd sd vss 1 20 21 40
datasheet datasheet 3/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) absolute maximum ratings (vss=0v) parameter symbol ratings unit remarks power supply voltage 1 vdd -0.3 to +4.5 v power supply power supply voltage 2 vlcd -0.5 to +7.0 v power supply for lcd power dissipation pd 0.8 w when operated more than ta=25 c, subtract 8.0mw per degree. (using rohm standard board) (board size:74.2mm74.2mm1.6mm material: fr4 board copper foil: land pattern only) input voltage range vin -0.5 to vdd +0.5 v operational temperature range topr -40 to +85 c storage temperature range tstg -55 to +125 c output current iout1 5 ma seg output iout2 5 ma com output iout3 10 ma gpo output iout4 50 ma led output caution :operating the ic over the absolute maximum ratings may damage t he ic.the damage can either be a short circui between pins or a n open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +85c, vss=0v) parameter symbol ratings unit remarks min typ max power supply voltage 1 vdd 1.8 - 3.6 v power supply power supply voltage 2 vlcd 2.7 - 5.5 v power supply for lcd output current iout4 - - 20 ma per led port 1ch electrical characteristics dc characteristics (ta= -40c to +85c, v dd=1.8v to 3.6v, vlcd=3.3v to 5.5v, vss=0) parameter symbol limits unit conditions min typ max ?h? level input voltage vih 0.8vdd - vdd v sd, scl, csb, clkin ?l? level input voltage vil vss - 0.2vdd v sd, scl, csb, clkin hysteresis width vh - 0.2 - v scl, vdd=3.3v, ta=25c ?h? level input current iih1 - - 5 a sd, scl, csb, clkin, vi=3.6v ?l? level input current iil1 -5 - - a sd, scl, csb, clkin, vi=0v ?h? level output voltage (note2) voh1 vlcd -0.4 - - v iload=-50a, vlcd=5.0v seg0 to seg27 voh2 vlcd -0.4 - - v iload=-50a, vlcd=5.0v, com0 to com3 voh3 vlcd -0.6 - - v iload=-1ma,vlcd=5.0v, seg23 to seg27(gpo mode) ?l? level output voltage (note2) vol1 - - 0.4 v iload= 50a, vlcd=5.0v, seg0 to seg27 vol2 - - 0.4 v iload= 50a, vlcd=5.0v, com0 to com3 vol3 - - 0.5 v iload=1ma, vlcd=5.0v, seg23 to seg27(gpo mode) vol4 - 0.11 0.5 v iload=20ma, vlcd=5.0v, led (note 1) power save mode 1 and frame inversion setting (note 2) iload: in this case, load current from only one port
datasheet datasheet 4/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) electrical characteristics ? continued dc characteristics (ta= -40c to +85c, v dd=1.8v to 3.6v, vlcd=3.3v to 5.5v, vss=0) parameter symbol limits unit conditions min typ max current consumption (note1) istvdd - 3 10 a input terminal all?l?, display off, oscillation off istvlcd - 0.5 5 a input terminal all?l?, display off, oscillation off ivdd1 - 8 15 a vdd=3.3v, ta=25c, 1/3bias, ffr=64hz, pwm generate off, all output pin open ivdd2 - 30 45 a vdd=3.3v, ta=25c, 1/3bias, ffr=64hz, pwm frequency=500hz setting, all output pin open ivlcd1 - 10 15 a vlcd=5.0v, ta=25c, 1/3bias, ffr=64hz, led generate off, all output pin open ivlcd2 - 30 48 a vlcd=5.0v, ta=25c, 1/3bias, ffr=64hz, pwm frequency=500hz setting, all output pin open (note 1) power save mode 1 and frame inversion setting (note 2) iload: in case, load current from only one port oscillation frequency characteristics (ta= -40c to +85c, vdd=1.8v to 3.6v, vlcd=2.7v to 5.5v, vss=0) parameter symbol limits unit conditions min typ max frame frequency 1 ffr1 57.6 64 70.4 hz vdd=3.3v, ta=25c, ffr=64hz setting frame frequency 2 ffr2 51.2 64 73.0 hz vdd=2.5v to 3.6v ffr=64hz setting frame frequency 3 ffr3 45.0 - 64 hz vdd=1.8v to 2.5v ffr=64hz setting about detail function, please refer to the frame frequency setting of disctl command. mpu interface characteristics (ta= -40c to +85 c, vdd=1.8v to 3.6v, vlcd=2.7v to 5.5v, vss=0) parameter symbol limits unit conditions min typ max input rise time tr - - 50 ns input fall time tf - - 50 ns scl cycle time tscyc 250 - - ns ?h? scl pulsewwidth tshw 50 - - ns ?l? scl pulse width tslw 50 - - ns sd setup time tsds 50 - - ns sd hold time tsdh 50 - - ns csb setup time tcss 50 - - ns csb hold time tcsh 50 - - ns ?h? csb pulse width tchw 50 - - ns figure 4. serial interface timing csb scl sd tcsh tscyc tsl w tshw tsds tsdh t f tr tcss tchw
datasheet datasheet 5/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) i/o equivalence circuit figure 5. i/o equivalence circuit circuit vd vss vss vlcd led vss seg0-22 com0-3 vlcd vss vlcd seg23-26 vss vd csb, sd, scl, clkin vss
datasheet datasheet 6/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) example of recommended circuit (1) led/gpo using case (2) seg output only case figure 6. bu97931fv-lb e.g. of recommended circuit 5. 0v 3. 3v vlcd vdd clkin csb sd scl vss bu97931 fv-lb lcd com 0 to com 3 seg0 to seg27 led input signal from controlle r clkin external clk input terminal in case being unused , connect to vss or be opened . in case being unused , open 5.0v 3.3 v vlcd vdd clkin csb sd scl vss bu 97931fv-lb lcd com 0 to com3 seg0 toseg22 led input signal from controlle r clkin external clk input terminal in case being unused , connect to vss or be opened . vled= 5. 0v *regarding resistor value please detect the value according to input current value ( current max = 20ma ) othe r device seg27( gpo 0) to seg23 ( gpo4)
datasheet datasheet 7/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) function description command and data transfer method 3-spi (3-wire serial interface) this device is controlled by a 3-wire signal (csb, scl, and sd). first, interface counter is initialized with csb=?h". setting csb=?l? enables sd and scl inputs. the protocol of 3-spi transfer is as follows. each command starts with command or data judgment bit (d/c) as msb data, fo llowed by data d6 to d0 (this is when csb =?l?). (internal data is latched at the rising edge of scl then it is converted to an 8-bit parallel data at the falling edge of the 8 th clk.) when csb changes from ?l? to ?h?, and at this time se nding commands are less than 8 bits, command and data transfer are cancelled. to start sending command again, please set csb=?l" and send command continuously. after sending ramwr or blkwr or gposet command, this device is in the ram data input mode. under this mode, device can not accept new commands. in this case, please execute a ?h? to ?l? transition at csb, after this sequence the device is released from ram data input mode, and can accept new command. figure 7. 3-spi data transfer format 8-bit data sending after ramwr command are display ram data 8-bit data sending after blkwr command are blink ram data scl and sd can be set to ?h? or cleared to ?l? during csb=?h? d/ c d/ c d3 d6 d0 d0 d6 d 6 d 5 d 4 d 3 d1 d 0 d/c d4 d3 d2 d1 scl csb sd d/c 3rd byte command d2 1st byte command 2nd byte command d 4 d 6 d 5 d1 d 2 d5
datasheet datasheet 8/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) write display data and transfer method this device has display data ram (ddram) of 284=112bit. the relationship between data input and display data, ddram data and address are as follows. according to this command, an 8-bit binary data will be written to ddram. the starting address of the ddram where data will be written is specified by ?adset" command, and is automatically incremented after every 4 bits of data received. writing data to ddram can be done by continuously sending data. (in case data is sent continuously af ter write date at 1bh (seg27), address return to address 00h (seg0) automatically.) in case seg port assigned to gpo port by outset co mmand, corresponding seg address do not change and is used as a dummy address. ddram address 00 01 02 03 04 05 06 07 ??? 19h 1ah 1bh bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 ??? seg 25 seg 26 seg 27 display data write to ddram every 4bits. in case csb changes from ?l? to ?h? before 4 bits of data transfer was finished, ram write is cancelled. figure 8. display data transfer method d0 d7 d5 d5 d6 1st byte command / 2nd byte command d4 d3 d2 d0 csb d4 d4 d2 d1 d5 d3 scl d7 d6 sd 1st byte command / 2nd byte command d6 d5 d4 d3 d7 d1 scl csb sd d2 d5 d4 d3 d2 d1 d0 command command d7 d6 internal signal ram write internal signal ram write address set command ramwr command ram write every 4bit address 00h address 01h address 02h address set command ramwr command display data address 00h address 30h address 31h addres00h auto increment return to address 00h data lower than 4bit case ram write is canceled displa y data 10000011 1st byte command a 00000000 a ddress set command 10100000 ram write 2nd byte command b display ram data c d ef g h i j kl m no p
datasheet datasheet 9/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) seg a seg b seg c seg d seg a seg b seg c seg d seg d blink frequency under the 2hz setting segment output will blink every 0.5 second (on->off->on) sega/b is blink segment output blink ram data ddram data blink function this device has blink function. blink function can set each segment port individually. blink on/off and blink frequency are set by the blkset command. blink frequency varies according to fclk characteristics. blink setup of each segment is controlled by blkwr command. the write start address is specified by ?blkadset" command. and this address will automatically increment after receiving every 4 bit s of blink data. the relation of blkwr command, blink ram data, and blinking segment port is below. in case data is ?1?, segment will blink, on the other hand when data is ?0?, segment will not blink. (in case data is written continuously after write data at 1b h (seg27), address will return to 00h (seg0) automatically.) please refer to the following figures about blink operation of each segment. in case seg port assigned to gpo port by outset comm and, corresponding seg address does not change and is used as a dummy address. blink ram address 00 01 02 03 04 05 06 07 ??? 19h 1ah 1bh bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 ??? seg 25 seg 26 seg 27 figure 9. blink operation 10000100 1st byte command 00000011 2nd byte command 10000111 00000000 blink set blink address set command 11000000 blink ramwr 1st byte command 2nd byte command a b c d e f g h i j k l m n o p blink ram data seg a seg b seg c seg d seg a seg b seg c seg d seg a seg b seg c seg d seg a seg b seg c
datasheet datasheet 10/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) lcd driver bias/duty circuit bu97931fv-lb generates lcd driving voltage using an on-chip buffer amp. also, it can drive lcd with low power consumption line and frame inversion can be set in modeset command. 1/4duty, 1/3duty and static mo de can be set disctl command. about each lcd driving waveform, please refer to ?lcd driving waveform? descriptions. initial state initial state after swrst command input display off all command register values are in reset state. ddram address data and blink address data are initialized (if ddram data and blink ram data are not initialized, wr ite ddram data and blink ram data before display on.) command / function list function description table no command function 1 mode set (modeset) sets lcd drive mode (display on/off, current mode) 2 display control (disctl) sets lcd drive mode (frame freq., line/frame inversion) 3 address set (adset) sets display data ram address for ramwr command 4 blink set (blkset) sets blink mode on/off 5 blink address set (blkadset) sets blink data ram address for blkwr command 6 seg/gpo port change (outset) selects segment output/gener al purpose output (gpo) 7 led drive control (pwmset) (h piece adjustment of pwm) sets pwm1 signal ?h? width for led driving 8 ram write (ramwr) writes display data to display data ram 9 blink ram write (blkwr) writes blink data to blink data ram 10 all pixel on (apon) sets all pixel display on 11 all pixel off (apoff) sets all pixel display off 12 all pixel on/off mode off (noron) sets normal display mode (apon/apoff cancel) 13 software reset (s wrst) software reset 14 osc external input (oscset) enables external clock input 15 gpo output set (gposet) sets gpo output data
datasheet datasheet 11/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) detailed command descriptions d/c, data / command judgment bit (msb) for details, please refer to 3-wire serial i/f 1. mode set (modeset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 0 1 81h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 00h display set condition p3 reset state display off 0 display on 1 display off: no lcd driving mode (output: vss level) turn off osc circuit and lcd power supply circuit. (synchronized with frame freq) display on: lcd driving mode turn on osc circuit and lcd power supply circuit. read data from ddram and display to lcd. led port and gpo port output states are not influenced by a display on/off state output state is decided by command setup (outset, gposet, pwmset) and inhb terminal state, respectively. for more details, please refer to each command description. lcd drive mode set condition p2 reset state frame inversion 0 line inversion 1 current mode set condition p1 p0 reset state power save mode1 0 0 power save mode2 0 1 normal mode 1 0 high power mode 1 1 (reference data of consumption current) condition current consumption power save mode 1 1.0 power save mode 2 1.7 normal mode 2.7 high power mode 5.0 (note) the value changes according to the panel load.
datasheet datasheet 12/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 2. display control (disctl) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 1 0 82h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 02h duty set condition p3 p2 reset state 1/4duty (1/3bias) 0 0 1/3duty (1/3bias) 0 1 static (1/1bias) 1 * *: don?t care in 1/3duty, display data and blink data of com3 are ineffective. com1 and com3 output are same data. please be careful in transmitting display data and blink data. the examples of seg/com output waveform, under each bi as/duty set up, are shown at "lcd driver bias/duty circuit" description. frame frequency set condition (1/4,1/3,1/1duty) p1 p0 reset state (128hz, 130hz, 128hz) 0 0 (85hz, 86hz, 64hz) 0 1 (64hz, 65hz, 48hz) 1 0 (51hz, 52hz, 32hz) 1 1 relation table, between frame frequencies (fr), int egrated oscillator circuit (osc) and divide number. disctl (p1,p0) divide fr [hz] (note1) duty set (p3,p2) duty set (p3,p2) (0,0) 1/4duty (0,1) 1/3duty (1,*) 1/1duty (0,0) 1/4duty (0,1) 1/3duty (1,*) 1/1duty (0,0) 160 156 160 128 131.3 128 (0,1) 240 237 320 85.3 86.4 64 (1,0) 320 315 428 64 65 47.9 (1,1) 400 393 640 51.2 52.1 32 (note1) fr is frame frequency, in ca se osc frequency = 20.48khz (typ). the formula, to calculate osc frequency from frame frequency is shown below. ? osc frequency = frame frequency (measurement value) x divide number ? divide number determined by using the value of frame frequency set (p1, p0) and duty setting (p3, p2). ex) (p1,p0) = (0,1) ,(p3,p2) = (0,1) => divide number= 237
datasheet datasheet 13/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 3. address set (adset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 1 1 83h - 2nd byte command 0 0 0 p4 p3 p2 p1 p0 - 00h sets start address to write ddram data. the address can be set from 00h to 1bh. do not set other address. (except 00h to 1bh address is not acceptable.) in case writing data to ddram, ma ke sure to send ramwr command. 4. blink set (blkset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1 st byte command 1 0 0 0 0 1 0 0 84h - 2 nd byte command 0 0 0 0 0 p2 p1 p0 - 00h set blink on/off. for more details, please refer to ?blink function". blink set blink mode(hz) p2 p1 p0 reset state off 0 0 / * 0 / * 1.6 1 0 0 2.0 1 0 1 2.6 1 1 0 4.0 1 1 1 *: don?t care 5. blink address set (blkadset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 1 1 1 87h - 2nd byte command 0 0 0 p4 p3 p2 p1 p0 - 00h sets ram start address to write blink data. the address can be set from 00h to 1bh. do not set other addresses. (except 00h to 1bh address is not acceptable) in case writing data to blink ram, make sure to send blkwr command.
datasheet datasheet 14/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 6. seg/gpo port change (outset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 1 0 0 0 88h - 2nd byte command 0 0 0 0 0 p2 p1 p0 - 00h set output mode, segment output or gpo output. p2 to p0: select changing port number. (seg23 to seg27 ports are seg mode/gpo mode selectable) in case gpo output is sele cted, terminal output data is set by gposet command. ex) in case seg 26 port is assigned to gpo, if gpo1 data is "h", gpo1 (seg26) port outputs "h" (vlcd level). if gpo1 data is "l", gpo1 (seg26) port outputs "l" (vss level). output terminal state under the p2 to p0 set condition is listed below. output terminal state condition seg terminal state (seg output/gpo output) p2 p1 p0 seg23 port seg24 por t seg25 port seg26 port seg27 port 0 0 0 seg23 seg24 seg25 seg26 seg27 0 0 1 seg23 seg24 seg25 seg26 gpo0 0 1 0 seg23 seg24 seg25 gpo1 gpo0 0 1 1 seg23 seg24 gpo2 gpo1 gpo0 1 0 0 seg23 gpo3 gpo2 gpo1 gpo0 1 0 1 gpo4 gpo3 gpo2 gpo1 gpo0 1 1 * (outset command will be canceled) in case the seg port is switched to the gpo port, ddram address and blink ram address do not change. in case ddram address and blink ram address, selected gpo output mode is dummy address.
datasheet datasheet 15/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 7. led drive-control (pwm ?h? width control) command (pwmset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 1 0 1 0 8ah - 2nd byte command 0 0 0 0 0 0 p7 p6 - 00h 3rd byte command 0 0 p5 p4 p3 p2 p1 p0 - 00h 2nd and 3rd byte command data can be set from 00h to 3fh (described as 8-bit binary data). in case other value is selected, sending command is ignored and 2nd and 3rd byte command data are set to 3fh. in reset state, 2nd and 3rd byte command data are set to 00h. in case the command is less than 3 byte, sending command is cancelled. according to pwmset command, led driving signal is adjustable. pwm ?h? width is adjustable by 8-bit resolution. explanation about p7 to p6 data of 2nd byte command an d p5 to p0 data of 3rd byte command are as follows: (the 2nd byte data are used as upper 2bit, and 3rd byte data are used as lower 6 bits.) 8bit mode: p7 data is used as msb of 8 bits, and p0 data is used lsb. led driving period is determined by the ?h? width of pwm sign al, generated by pwm generator circuit (resolution: 8bit). ex) in case external pwm clock is 125 khz, parameter setting value is 127 (7fh) 1-bit resolution: 8us all hi set: pwm signal frequency about 500hz, h width about 2.00msec all low set: pwm signal frequency about 500hz, h width 0usec (in case 8bit resolution) this command is reflected, synchron izing with a next pwm frame head. and, led port output is as follows. led port operation does not affect display on/off state. (note) pwm frequency and pwm ?h? width calculation pwm cycle and pwm ?h? width, decided by pwm clock cycle are described as follows. (pwm clock cycle is a minimum unit of pwm ?h? width) pwm frequency = pwm clock cycle (number of the steps (8bit =256) - 1) pwm h width = pwm clock cycle parameter set value (8bit: 0 to 255) pwm duty = pwm h width/pwm cycle = parameter set value / number of the steps in case pwm is generated from the internal clock, the pwm cycle varies depending on the osc frequency. in case led is used as back light of lcd panel and pwm is generated from internal clock, there is a possibility that the display will flicker. for such cases, please use under the pwm width all ?l? or all ?h? setting only. pwm (all hi pwm (all low duty shift ffh 00h (h width: wide) (h width: narrow
datasheet datasheet 16/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 8. ram write (ramwr) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 1 0 0 0 0 0 a0h - 2nd byte command display data random ???? n byte command display data random input data, sending after 1st byte command, are used as disp lay data. and display data are sent every 4 bits. please set this command after the adset command. 9. blink ram write (blkwr) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 1 0 0 0 0 0 0 c0h - 2nd byte command blink data random ???? n byte command blink data random input data, sending after 1st byte command, are used as disp lay data. and display data are sent every 4 bits. please set this command after the blkadset command. 10. all pixel on (apon) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 0 1 91h - after sending the command, all seg outputs set di splay on state regardless of the ddram data. (this command affect to the seg output terminal only except gpo and led output.) 11. all pixel off (apoff) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 0 0 90h - after sending the command, all seg outputs set di splay off state regardless of the ddram data. (this command affects the seg output termi nals only except gpo and led outputs.) 12. all pixel on/off mode off (noron) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 1 1 93h - after sending the command, all seg outputs are released from apon/apoff state. and seg port outputs signal follows ddram data. (this command affects the seg output te rminals only except gpo and led output.) after reset sequence or swreset, all outputs are set to noron state. 13. software reset (swrst) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 1 0 92h - after sending the command, device is set to the default state.
datasheet datasheet 17/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 14. osc external input command (oscset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 1 0 0 0 98h - 2nd byte command 0 0 0 0 0 p2 p1 p0 - 00h sets the type of clock mode. there are 4 selectable modes including external clock input mode. details of this command function are as follows. condition p2 p1 p0 reset state internal clk (pwm generation off) 0 0 0 external clk input for pwm (pwm generation off) 0 0 1 internal clk (pwm generation on 0 1 0 external clk input for pwm (pwm generation on) 0 1 1 external clk input for display (rohm use only) 1 * * (*: don?t care) (p2, p1, p0) = (0, 0, 1): external pwm input mode clkin external pwm input available. pwmout: ?l? output (note) under the (p2, p1, p0) = (0, 0, 0) condition pwmout into same state (p2, p1, p0) = (0, 1, 0): pwm is generat ed from an internal oscillating frequency (p2, p1, p0) = (0, 1, 1): pwm is generated from an external clk input from clkin pwm width is set up by pwmset and pwmset command. in case led is used as back light of lcd panel and pwm is generat ed from internal clock, display flickering will occur. in this case, please use under the pwm width all?l? or all ?h? setting only. the relation of osc function control by each command is as follows: figure 10. osc external input led external clock external pwm oscset command pwmset command pwm generation clkin terminal integrated osc
datasheet datasheet 18/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) 15. gpo output set command (gposet) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 1 0 1 0 9ah - 2nd byte command 0 0 0 p4 p3 p2 p1 p0 - 00h set gpo output data. the relation between seg port (gpo port) and data is shown below. gposet data gpo port seg port p0 gpo0 seg27 p1 gpo1 seg26 p2 gpo2 seg25 p3 gpo3 seg24 p4 gpo4 seg23 gpo data output is asynchronous from frame cycle. in case inhb=?h?, gpo output signal follows gposet data, on the other hand, in case in hb=?l? gpo output is at gnd level. gpo output is not af fected by display on/off state.
datasheet datasheet 19/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) lcd driving waveform figure 11. waveform of line inversion figure 12. waveform of frame inversion 1/4duty line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a (com0-segn) (com0-segn) stateb stateb (com1-segn) (com1-segn) segn+2 segn+3 com2 com3 com0 state a segn+2 segn+3 com1 stateb segn segn+1 com3 state a segn segn+1 com0 com1 com2 stateb vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg
datasheet datasheet 20/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) figure 13. waveform of line inversion figure 14. waveform of frame inversion 1/3duty line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a (com0-segn) (com0-segn) stateb stateb (com1-segn) (com1-segn) segn+2 segn+3 com3 state a segn segn+1 com0 com1 com2 stateb segn+2 segn+3 com0 state a segn segn+1 com1 stateb com2 com3 vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg when 1/3duty com3 and com1 is same when 1/3duty com3 and com1 is same when 1/3duty com3 and com1 is same
datasheet datasheet 21/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) figure 15. waveform of line inversion figure 16. waveform of frame inversion 1/1duty (static) line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a stateb stateb com2 com3 stateb stateb com1 segn+2 segn+3 com0 state a segn segn+1 segn+2 segn+3 com3 state a segn segn+1 com0 com1 com2 vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg when 1/1duty (static) com1 / com0 is same waveform com2 / com0 is same waveform when 1/1duty (static) com1 / com0 is same waveform com2 / com0 is same waveform when 1/1duty (static) com1 / com0 is same waveform com2 / com0 is same waveform com3 / com0 is same waveform
datasheet datasheet 22/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) initialize sequence recommended input sequence is listed below, before starting lcd driving. (refer to power on/off sequence) input voltage supply csb ?h? ?interface initializing csb ?l? ?interface command sending swrst ?software reset modeset ?display off various commands setting ram write blink ram write modeset ?display on start lcd driving before initializing sequence, ddram address, ddram data, blink address and blink data are random.
datasheet datasheet 23/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) vdd tr toff vbot vde t cautions on power-on/ power-off condition por circuit bu97931fv-lb has ?p.o.r? (power-on reset) circuit and software reset function. please follow the recommended power-on conditions in order to power up properly. (1) please set power up conditions, follow the recommended tr, tf, toff, and vbot specification below in order to ensure p.o.r operation. (*the detection voltage of por varies because of envir onment etc. to operate por properly, please satisfy vbot lower than 0.5v condition.) figure 17. power on/off waveform (2) if it is difficult to meet the above conditions , execute the following sequence after power-on. (1) csb=?l? :?h? condition (2) after csb?h? : ?l?, execute swrst command in addition, in order to the software reset comma nd certainly, please wait 1ms after a vdd level reaches to 90% and csb=?l? :?h?. *before swrst command input device will be in uns table state, since swrst command does not operate perfect substitution of a por function. vdd csb min 1ms min 50ns swrst command figure 18. swrst command sequence recommended condition of tr, tf, toff, vbot tr toff vbot vdet less than 10ms over 1ms less than 0.5v typ 1.2v * vdet : por detect level
datasheet datasheet 24/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) attention about input port pull down satisfy the following sequence if input terminals are pull ed down by external resistors (in case mpu output hi-z). figure 19. recommended sequence when input ports are pulled down bu97931fuv-lb adopts a 5v tolerant i/o for t he digital input. this circuit includes a bus-hold function to keep high level. a pull down resistor of below 10k ? shall be connected to the input terminals for transitions from high to low because the bus-hold transistor turns on during t he input?s high level. (refer to t he figure 5; i/o equivalent circuit) a higher resistor than 10k ? (approximate) causes input terminals being stead y by intermediate potential between high and low level so unexpected current is consumed by the system. the potential depends on the pull down resistance and bus-hold transistor?s resistance. as the bus-hold transistor turns off upon the input level is clear ed to low, a higher resistor can be used as a pull down resistor if mpu sets sd and scl lines to low before it releases the lines. the low period preceding mpu?s bus release shall be at l east 50ns as same as a minimum clk width ( tslw ). scl sd csb date transaction period with mpu input "l" period input"hi-z" period
datasheet datasheet 25/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic duri ng assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet datasheet 26/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) operational notes ? continued 11. unused input pins input pins of an ic are oft en connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction th rough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore , do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in t he electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit.
datasheet datasheet 27/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) ordering information b u 9 7 9 3 1 f v - l b e 2 part number package products class lb for industrial applications packaging and forming specification e2: embossed tape and reel ( ssop-b40 ) fv : ssop-b40 marking diagram ssop-b40 (top view) bu97931 part number marking lot number 1pin mark
datasheet datasheet 28/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) physical dimension, tape and reel information package name ssop-b40 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (max 13.95 (include. burr)
datasheet datasheet 29/29 tsz02201-0p4p0d300490-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 bu97931fv-lb max 112 segments (seg28com4) revision history date revision changes 23.aug.2013 001 new release 26.feb.2014 002 delete sentence ?and log life cycle? in general description and futures. applied new style (change of the size of the title).
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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